Multi-die integrated circuit structure with heat sink

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9082633
APP PUB NO 20130093074A1
SERIAL NO

13272500

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

An integrated circuit structure can include a first die including a first surface and a second surface and a second die including a first surface and a second surface. The first surface of the first die can be coupled to the second surface of the second die. The integrated circuit structure also can include a heat sink coupled to the first surface of the first die and the first surface of the second die.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
XILINX INC2100 LOGIC DRIVE SAN JOSE CA 95124

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Grant, Douglas M Gorebridge, GB 18 184

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jan 14, 2027
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00