ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME
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United States of America Patent
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Issued Date -
Apr 18, 2013
app pub date -
Sep 13, 2012
filing date -
Oct 17, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An electronic device includes: a first insulating film; an interconnection trench on a surface of the first insulating film; an interconnection pattern composed of Cu, the interconnection trench being filled with the interconnection pattern; a metal film on a surface of the interconnection pattern, the metal film having a higher elastic modulus than Cu; a second insulating film on the first insulating film; and a via plug composed of Cu and arranged in the second insulating film, the via plug being in contact with the metal film.
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