SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Apr 18, 2013
app pub date -
Mar 22, 2012
filing date -
Oct 17, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
According to one embodiment, a semiconductor device is provided. The semiconductor device includes a package substrate; a first semiconductor chip mounted on the package substrate and adapted to include a plurality of first bonding pads arranged in a first order on an upper surface; a second semiconductor chip arranged on the first semiconductor chip and adapted to include a plurality of second bonding pads arranged in the first order on an upper surface; and first bonding wires configured to connect each of the plurality of first bonding pads and the plurality of second bonding pads.
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