METHOD AND APPARATUS FOR REDUCING PRESSURE EFFECTS ON AN ENCAPSULATED DEVICE
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United States of America Patent
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Issued Date -
Apr 18, 2013
app pub date -
Oct 11, 2012
filing date -
Oct 14, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and apparatus for reducing pressure effects on an encapsulated device. In one embodiment, the apparatus comprises a power module comprising an equipment box assembly containing (i) an equipment module housing, (ii) a potted electronic device disposed within the equipment module housing, and (iii) a resilient expansion absorption layer disposed between at least a portion of the potted electronic device and at least a portion of the equipment module housing.
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