Microphone Unit, Method of Manufacturing Microphone Unit, Electronic Apparatus, Substrate for Microphone Unit and Method of Manufacturing Substrate for Microphone Unit

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20130094689A1
SERIAL NO

13649297

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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This microphone unit includes a vibrating portion converting a sound to an electric signal, a substrate having a first surface where the vibrating portion is set and a second surface opposite to the first surface and including a hollow portion transmitting a sound therein, and a coating layer formed on an inner surface of the hollow portion of the substrate. The substrate further includes a first substrate sound hole portion provided on the first surface for causing the hollow portion and the vibrating portion to communicate with each other, a second substrate sound hole portion provided on the first surface for causing the hollow portion and the exterior to communicate with each other, and a coating liquid draining hole portion provided on the second surface for causing the hollow portion and the exterior to communicate with each other.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
FUNAI ELECTRIC CO LTDDAITO OSAKA 574-0013

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
TANAKA, Fuminori Daito-shi, JP 87 860
Ushiyama, Yuji Ishioka-shi, JP 2 40

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