Semiconductor device and method of manufacturing the same

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United States of America Patent

PATENT NO 8754433
APP PUB NO 20130095656A1
SERIAL NO

13708798

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Abstract

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According to one embodiment, a semiconductor device includes a switch element provided in a surface area of a semiconductor substrate, a contact plug with an upper surface and a lower surface, and a function element provided on the upper surface of the contact plug. The lower surface of the contact plug is connected to the switch element. The upper surface of the contact plug has a maximum roughness of 0.2 nm or less.

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Patent Owner(s)

Patent OwnerAddress
KIOXIA CORPORATIONTOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amano, Minoru Sagamihara, JP 89 2433
Eda, Hajime Kawasaki, JP 21 111
Iwayama, Masayoshi Yokohama, JP 33 502
Kodera, Masako Yokohama, JP 50 719
Matsui, Yukiteru Yokohama, JP 87 573
Minamihaba, Gaku Yokohama, JP 96 963
Sato, Motoyuki Yokohama, JP 62 497
Suguro, Kyoichi Yokohama, JP 159 4159
Yoshikawa, Masatoshi Yokohama, JP 147 3698

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