Plasma confinement rings including RF absorbing material for reducing polymer deposition

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United States of America Patent

PATENT NO 9123650
APP PUB NO 20130095666A1
SERIAL NO

13706640

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Abstract

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Plasma confinement rings are adapted to reach sufficiently high temperatures on plasma-exposed surfaces of the rings to substantially reduce polymer deposition on those surfaces. The plasma confinement rings include an RF lossy material effective to enhance heating at portions of the rings. A low-emissivity material can be provided on a portion of the plasma confinement ring assembly to enhance heating effects.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH CORPORTION4650 CUSHING PARKWAY FREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rogers, James H Milpitas, US 20 218

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