Importance

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Abstract

The present disclosure relates to sensors that are exposed to media during use. In some cases, a sensor assembly includes a sensor element positioned on a substrate, where the sensor element may be mechanically and electrically connected to the substrate and may be in fluid communication with a media inlet port. The sensor assembly may include a cover sealed to the substrate of the sensor assembly to enclose the sensor element in a sealed chamber. In some instances, the sensor assembly may include a bonding layer on the substrate of the sensor assembly, and the cover may be sealed to the bonding layer to form the sealed chamber. In some instances, the sealed chamber may help provide a fail-safe media seal for the sensor assembly in the event the sensor element forms a leak during use.

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First Claim