Multiple layer printed circuit board with unplated vias

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8889999
SERIAL NO

13280008

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A printed circuit board (PCB) stack-up has a signal via configured to transmit a signal through at least two different layers of the PCB stack-up, a reference structure that is at least a portion of a return path for the signal; and an unplated via disposed in an area surrounding the signal via. The unplated via is disposed in the area surrounding the signal via to improve the characteristic impedance of the signal via.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
CISCO TECHNOLOGY INC170 WEST TASMAN DRIVE SAN JOSE CA 95134

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Senk, David San Ramon, US 5 81
Thurairajaratnam, Aritharan San Jose, US 28 381

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
11.5 Year Payment $7400.00 $3700.00 $1850.00 May 18, 2026
Fee Large entity fee small entity fee micro entity fee
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00