Method for Selective Metallization on a Ceramic Substrate
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United States of America Patent
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Issued Date -
Apr 25, 2013
app pub date -
Dec 8, 2011
filing date -
Oct 19, 2011
priority date (Note) -
Abandoned
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Abstract
A method of selective metallization on a ceramic substrate includes selectively forming an active brazing material on a predetermined area of a surface of a ceramic substrate, attaching the metal layer to the ceramic substrate with the active brazing material, performing a brazing process on the active brazing material, forming an etching stop layer on the metal layer and performing an etching process, and removing the etching stop layer. The method can be applied to a severe environment, and the conchoidal fracture between the ceramic substrate and the metal layer can also be avoided. The present invention not only simplifies the process but also improves the product yield.
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