Hermetic Surface Mount Packages for Diodes and Transistors
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United States of America Patent
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Issued Date -
Apr 25, 2013
app pub date -
Oct 19, 2012
filing date -
Oct 19, 2011
priority date (Note) -
Abandoned
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Abstract
A discrete semiconductor package includes a discrete semiconductor device disposed upon a non-conductive substrate, with via-connected upper and lower conductive ports. By utilizing a plurality of vias to connect the ports within the non-conductive substrate, and by depositing metals directly upon the surface of the substrate, manufacturing of such semiconductor packages is cheaper and more effective.
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