Method for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough
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United States of America Patent
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Jun 3, 2014
Grant Date -
Apr 25, 2013
app pub date -
Oct 24, 2012
filing date -
Oct 24, 2011
priority date (Note) -
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Abstract
A method for producing an electrical feedthrough in a substrate includes: forming a first printed conductor on a first side of a substrate which electrically connects a first contact area of the substrate on the first side; forming a second printed conductor on a second side of a substrate which electrically connects a second contact area of the substrate on the second side; forming an annular trench in the substrate, a substrate punch being formed which extends from the first contact area to the second contact area; and selectively depositing an electrically conductive layer on an inner surface of the annular trench, the substrate punch being coated with an electrically conductive layer and remaining electrically insulated from the surrounding substrate due to the annular trench.
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