Semiconductor device and method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9123544
APP PUB NO 20130099383A1
SERIAL NO

13278681

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Abstract

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An electrical device includes a semiconductor chip. The semiconductor chip includes a routing line. An insulating layer is arranged over the semiconductor chip. A solder deposit is arranged over the insulating layer. A via extends through an opening of the insulating layer to electrically connect the routing line to the solder deposit. A front edge line portion of the via facing the routing line is substantially straight, has a concave curvature or has a convex curvature of a diameter greater than a maximum lateral dimension of the via.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGGERMAN NOE BE BERG

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Birzer, Christian Burglengenfeld, DE 6 71
Meyer-Berg, Georg Munich, DE 74 582

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