Wafer backside coating process with pulsed UV light source

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United States of America Patent

PATENT NO 8791033
APP PUB NO 20130099396A1
SERIAL NO

13707941

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Abstract

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A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.

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Patent Owner(s)

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HENKEL IP & HOLDING GMBHHENKELSTRASSE 67 DUESSELDORF 40589

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gasa, Jeffrey Long Beach, US 7 12
Hajela, Sharad San Carlos, US 10 72
Kong, Shengqian Hillsborough, US 18 88
Leon, Jeffrey Long Beach, US 19 57
Phan, Dung Nghi Long Beach, US 3 3

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