Via structures and compact three-dimensional filters with the extended low noise out-of-band area
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United States of America Patent
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Jun 7, 2016
Grant Date -
Apr 25, 2013
app pub date -
Jun 30, 2010
filing date -
Jun 30, 2010
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Abstract
A filter of the present invention includes a plurality of via structures with a multilayer substrate. Each of the plurality of via structures includes first, second and third functional sections. One end of a signal via of the first functional section is connected to one end of a signal via of the second functional section and another end of the signal via of the second functional section is connected to two signal vias of the third functional section. Those signal vias are surrounded by a plurality of ground vias. Input and output ports of the filter are connected to another end of the signal via of each first functional section.
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