Process for adding thermoset layer to piezoelectric printhead
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United States of America Patent
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Dec 17, 2013
Grant Date -
Apr 25, 2013
app pub date -
Oct 24, 2011
filing date -
Oct 24, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto; (b) aligning an electrical circuit board having a fill joint with the piezoelectric transducers and temporarily attaching the electrical circuit board to the piezoelectric transducers, thereby creating a layered structure having interstitial spaces between the diaphragm plate, the piezoelectric transducers, and the electrical circuit board; (c) applying a thermoset polymer through the fill joint and allowing it to fill the interstitial spaces via capillary action; and (d) curing the thermoset polymer to form an interstitial polymer layer.
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