METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP ELEMENT, SOLID-STATE IMAGE PICKUP ELEMENT, IMAGE PICKUP DEVICE, ELECTRONIC APPARATUS, SOLID-STATE IMAGE PICKUP DEVICE, AND METHOD OF MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE

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United States of America Patent

APP PUB NO 20130100324A1
SERIAL NO

13649524

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed herein is a method of manufacturing a solid-state image pickup element having a lens provided above a light receiving portion. The manufacturing method includes: forming a lens base material layer composing the lens; forming an intermediate film having a thermal expansion coefficient larger than that of a resist on the lens base material layer; forming the resist in contact with the intermediate film; forming the resist into a lens shape by thermal reflow; and transferring the lens shape of the resist to the lens base material layer by etching, thereby forming the lens.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATION1-7-1 KONAN MINATO-KU TOKYO 1080075 ?1080075

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ogino, Akiko Kumamoto, JP 21 285
Ootsuka, Yoichi Kumamoto, JP 52 319
Toumiya, Yoshinori Kumamoto, JP 26 287
Yamamoto, Atsushi Kumamoto, JP 486 6100

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