Importance

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Abstract

In first and second electrode pads adjacent to each other formed over a multilayer substrate, the first electrode pad is connected with a first conductive via and a first internal layer conductive line successively. The second electrode pad is connected with a surface layer conductive line, third electrode pad, second conductive via, and second internal layer conductive line of the multilayer substrate. A ground conductive via or a power source conductive via is disposed between the first internal layer conductive line and the surface layer conductive line. A ground conductive line layer or power source conductive line layer is disposed between a first formation layer where the first internal layer conductive line is formed and a second formation layer where the second internal layer conductive line is formed. The first and second electrode pads are connected with the electrode pads formed on the surface of first and second optical devices.

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First Claim