METHOD FOR DEPOSITING CYCLIC THIN FILM

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United States of America Patent

APP PUB NO 20130101752A1
SERIAL NO

13808111

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Abstract

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Provided is a method of depositing a cyclic thin film that can provide excellent film properties and step coverage. The method includes the steps of depositing an insulating film by repeatedly performing a deposition step for depositing silicon on a substrate by injecting a silicon precursor into a chamber into which the substrate is loaded, a first purge step for removing a non-reacted silicon precursor and a reacted byproduct from the chamber, a reaction step for forming the deposited silicon as an insulating film including silicon by supplying a first reaction gas into the chamber and a second purge step for removing a non-reacted first reaction gas and a reacted byproduct from the chamber; and densifying the insulating film including silicon by supplying a plasma atmosphere into the chamber.

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Patent Owner(s)

Patent OwnerAddress
EUGENE TECHNOLOGY CO LTD42 CHUGYE-RO YANGJI-MYEON CHEOIN-GU YONGIN-SI GYEONGGI-DO 17156

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Hai Won Gyeonggi-do, KR 26 705
Woo, Sang Ho Gyeonggi-do, KR 33 1093

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