Sequentially Primed Printed Substrate
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United States of America Patent
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Issued Date -
Apr 25, 2013
app pub date -
Oct 25, 2012
filing date -
Oct 25, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A sequentially primed printed substrate and method of forming the printed substrate are provided. The substrate is formed by the steps of: 1) providing a film printed with one or more layers of ink; 2) applying a layer of primer to the ink and/or film; 3) drying or curing the layer of primer; 4) applying a layer of radiation-curable varnish to the primer-coated film; and 5) curing the varnish.
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