METHOD OF FORMING PATTERN
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United States of America Patent
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Issued Date -
Apr 25, 2013
app pub date -
Sep 16, 2011
filing date -
Sep 17, 2010
priority date (Note) -
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Abstract
Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing an organic solvent, wherein the developer contains an ester and a ketone having 7 or more carbon atoms.
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