WAFER BACKSIDE COATING CONTAINING REACTIVE SULFUR COMPOUND

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United States of America Patent

APP PUB NO 20130101856A1
SERIAL NO

13707803

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Abstract

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A wafer backside coating compositions comprises an epoxy, a resin with ethylenic unsaturation, and a reactive sulfur compound and is effective to reduce delamination during reflow operations.

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Patent Owner(s)

Patent OwnerAddress
HENKEL IP & HOLDING GMBHHENKELSTRASSE 67 DUESSELDORF 40589

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gasa, Jeffrey Long Beach, US 7 12
Hajela, Sharad San Carlos, US 10 72
Kong, Shengqian Hillsborough, US 18 88
Leon, Jeffrey Long Beach, US 19 57
Phan, Dung Nghi Long Beach, US 3 3

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