METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

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United States of America Patent

APP PUB NO 20130102141A1
SERIAL NO

13658541

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Abstract

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A method for manufacturing a MOSFET includes the steps of preparing a substrate (10) composed of silicon carbide, forming a gate oxide film (20) in contact with the substrate (10), and introducing nitrogen atoms in a region including an interface between the substrate (10) and the gate oxide film (20). Then, in the step of introducing nitrogen atoms, the substrate (10) on which the gate oxide film (20) has been formed is heated in an atmospheric gas formed by heating a nitriding process gas containing nitrogen atoms but not containing oxygen atoms to a temperature exceeding 1200° C., so that nitrogen atoms are introduced in the region including the interface between the substrate (10) and the gate oxide film (20).

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTD5-33 KITAHAMA 4-CHOME CHUO-KU OSAKA-SHI OSAKA 5410041 JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SHIMAZU, Mitsuru Osaka-shi, JP 13 132
SHIOMI, Hiromu Osaka-shi, JP 68 1104

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