Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media
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United States of America Patent
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Dec 10, 2013
Grant Date -
Apr 25, 2013
app pub date -
Dec 11, 2012
filing date -
Sep 1, 2004
priority date (Note) -
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Abstract
Methods and systems for removing materials from microfeature workpieces are disclosed. A method in accordance with one embodiment of the invention includes providing a microfeature workpiece having a substrate material and a conductive material that includes a refractory metal (e.g., tantalum, tantalum nitride, titanium, and/or titanium nitride). First and second electrodes are positioned in electrical communication with the conductive material via a generally organic and/or non-aqueous electrolytic medium. At least one of the electrodes is spaced apart from the workpiece. At least a portion of the conductive material is removed by passing an electrical current along an electrical path that includes the first electrode, the electrolytic medium, and the second electrode. Electrolytically removing the conductive material can reduce the downforce applied to the workpiece.
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