ORGANIC PARTICULATE LOADED POLISHING PADS AND METHOD OF MAKING AND USING THE SAME
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United States of America Patent
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Issued Date -
Apr 25, 2013
app pub date -
Dec 28, 2010
filing date -
Dec 30, 2009
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Abandoned
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Abstract
Polishing pads including organic particulates in a continuous polymer phase, and methods of making and using such pads in a polishing process. In one exemplary embodiment, the polishing pads include a multiplicity of polishing elements integrally formed in a sheet. In another exemplary embodiment, the polishing elements are bonded to a support layer, for example by thermal bonding. In certain embodiments, the polishing pad may additionally include a compliant layer affixed to the support layer, and optionally, a polishing composition distribution layer.
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