Administering thermal distribution among memory modules with call stack frame size management
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United States of America Patent
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Nov 19, 2013
Grant Date -
Apr 25, 2013
app pub date -
Dec 11, 2012
filing date -
Aug 16, 2011
priority date (Note) -
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Abstract
Administering thermal distribution among memory modules in a computing system that includes temperature sensors, where each temperature sensor measures temperature of a memory module and thermal distribution is effected by: determining, in real-time by a user-level application in dependence upon the temperature measurements of the temperature sensors, whether a memory module is overheated; if a memory module is overheated and if a current call stack frame is stored on the overheated memory module, increasing, by the user-level application, a size of the current call stack frame to fill remaining available memory space on the overheated memory module, ensuring a subsequent call stack frame is stored on a different memory module.
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