SUBSTRATE PROCESSING DEVICE AND IMPEDANCE MATCHING METHOD
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United States of America Patent
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Issued Date -
May 2, 2013
app pub date -
Oct 31, 2012
filing date -
Oct 31, 2011
priority date (Note) -
Abandoned
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Abstract
Provided are a substrate processing device and an impedance matching method. The substrate processing device includes: a high frequency power source for generating high frequency power; a process chamber for performing a plasma process by using the high frequency power; a matching circuit for compensating for a changed impedance of the process chamber; and a transformer disposed between the process chamber and the matching circuit in order to reduce the impedance of the process chamber.
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