HEAT DISSIPATION DEVICE
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United States of America Patent
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Issued Date -
May 2, 2013
app pub date -
Oct 17, 2012
filing date -
Oct 27, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An exemplary heat dissipation device is adapted for dissipating heat generated from electronic components having different heights. The heat dissipation device includes a base plate and a first heat absorbing member and a second heat absorbing member extending from a top side of the base plate and having different heights for contacting the electronic components having different heights.
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