Member for solid-state image pickup device and method for manufacturing solid-state image pickup device having first and second wiring structures with a concave portion between first and second substrates
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 28, 2015
Issued Date -
N/A
app pub date -
Jul 4, 2011
filing date -
Jul 9, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A member for a solid-state image pickup device having a bonding plane with no gaps and a method for manufacturing the same are provided. The manufacturing method includes the steps of providing a first substrate provided with a photoelectric converter on its primary face and a first wiring structure, providing a second substrate provided with a part of a peripheral circuit on its primary face and a second wiring structure, and performing bonding so that the first substrate, the first wiring structure, the second wiring structure, and the second substrate are disposed in this order. In addition, at least one of an upper face of the first wiring structure and an upper face of the second wiring structure has a concave portion, and a conductive material forms a bottom face of the concave portion.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully