Solid-state imaging apparatus having a sealing portion to reduce water invasion into the plurality of pixels and the peripheral circuit in a first member and a second member and method for manufacturing the solid-state imaging apparatus
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United States of America Patent
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Mar 24, 2015
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N/A
app pub date -
Jun 24, 2011
filing date -
Jun 30, 2010
priority date (Note) -
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Abstract
A solid-state imaging apparatus includes a first substrate that includes a plurality of photoelectric conversion units, a second substrate that includes at least a part of a readout circuit configured to read signals based on electric charges of the plurality of photoelectric conversion units and a peripheral circuit including a control circuit, and a wiring structure that is disposed between the first substrate and the second substrate and includes a pad portion electrically connected to the peripheral circuit via a draw-out wiring and an insulating layer. The wiring structure has, at least at a part thereof, a seal ring disposed in such a way as to surround the photoelectric conversion units and the peripheral circuit.
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