Semiconductor device

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United States of America Patent

PATENT NO 8803244
APP PUB NO 20130105911A1
SERIAL NO

13655873

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Abstract

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A semiconductor device includes a first conductivity type base formed on a surface of a substrate, a second conductivity type emitter formed on a surface of the base, a second conductivity type doped region which, along with accepting a first type of carrier from the emitter, injects the first type of carrier into the base, and is arranged to be spaced apart on the surface of the base from the emitter, and a second conductivity type collector which is formed on an opposite side to the emitter and the doped region, interposing the base.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATIONTOKYO 108-0075

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mori, Hideki Kanagawa, JP 117 1098

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