Microsystem device and methods for fabricating the same

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United States of America Patent

PATENT NO 9778039
SERIAL NO

13665163

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Abstract

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A microsystem includes a base layer formed from an electrical insulating material. The base layer has an inner surface defining a cavity and an external surface opposed to the inner surface, and in direct communication with an environment. A cap layer and a microelectromechanical (MEMS) device layer are formed from electrical insulating material or an other electrical insulating material. The cap has an inner surface defining a cavity, and an external surface opposed to the inner surface, and in direct communication with the environment. A MEMS device on/in the MEMS device layer is disposed between the base and the cap. Respective adjacent portions of the base, the cap and the device substrate are bonded to define an enclosed space. The enclosed space at least partially includes the base cavity or the cap cavity. At least a portion of a MEMS device on the device layer is in the enclosed space.

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Patent Owner(s)

Patent OwnerAddress
THE REGENTS OF THE UNIVERSITY OF MICHIGAN1600 HURON PARKWAY BUILDING 520 ANN ARBOR MI 48109

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cao, Zongliang Ann Arbor, US 6 57
Cho, Jae Yoong Ann Arbor, US 13 107
Gregory, Jeffrey Burlington, US 2 59
He, Guohong Ann Arbor, US 6 66
Najafi, Khalil Ann Arbor, US 58 1559
Peterson, Rebecca L Ann Arbor, US 7 81
Yuan, Yi Ann Arbor, US 90 395

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