Semiconductor device including in wafer inductors, related method and design structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8809998
APP PUB NO 20130105941A1
SERIAL NO

13282123

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Abstract

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An Integrated Circuit (IC) and a method of making the same. In one embodiment, the IC includes: a substrate; a first set of trenches formed in a first surface of the substrate; a second set of trenches formed in a second surface of the substrate; and at least one through silicon via connecting the first set of trenches and the second set of trenches.

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Patent Owner(s)

Patent OwnerAddress
GLOBALFOUNDRIES INCMAPLES CORPORATE SERVICES LIMITED PO BOX 309 UGLAND HOUSE GRAND CAYMAN KY1-1104

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Camillo-Castillo, Renata A Essex Junction, US 16 512
Ellis-Monaghan, John J Grand Isle, US 258 2660
Rassel, Robert M Colchester, US 110 1084
Vanslette, Daniel S Faifax, US 24 129

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