Lead frame semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 8928136
SERIAL NO

13659557

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Importance

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Abstract

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A lead frame includes: a chip-mounting region provided on a front surface; a lead region including a plurality of concave and convex sections arranged in an in-plane direction of the chip-mounting region; and a terminal arranged in the concave section. A thickness of the lead region from the front surface is smaller than a thickness of the terminal from the front surface.

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Patent Owner(s)

Patent OwnerAddress
SONY CORPORATION1-7-1 KONAN MINATO-KU TOKYO 1080075 ?1080075

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eimori, Akihisa Kagoshima, JP 1 5
Watanabe, Shinji Kagoshima, JP 271 3546

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