Low inductance power module
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United States of America Patent
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Jun 18, 2013
Grant Date -
May 2, 2013
app pub date -
Oct 31, 2011
filing date -
Oct 31, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
A power module includes a housing, a power semiconductor die enclosed within the housing and a first power terminal embedded in the housing and electrically connected to the power semiconductor die. A portion of the first power terminal protrudes outward from an external surface of the housing. The power module further includes a second power terminal embedded in the housing and electrically connected to the power semiconductor die and electrically insulated from the first power terminal. A portion of the second power terminal protrudes outward from the external surface of the housing by a distance less than the portion of the first power terminal so that the module has power connections with different heights.
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