Three-dimensional chip-to-wafer integration

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United States of America Patent

PATENT NO 9190391
SERIAL NO

13281534

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Abstract

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An integrated circuit device is disclosed that includes a semiconductor substrate and a die attached to the semiconductor substrate. A conductive pillar is connected to at least one of the semiconductor substrate or the die. An overmold is molded onto the semiconductor substrate over the die, and the conductive pillar extends through the overmold.

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Patent Owner(s)

Patent OwnerAddress
MAXIM INTEGRATED PRODUCTS INC160 RIO ROBLES DR SAN JOSE CA 95134

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kelkar, Amit Subhash Flower Mound, US 3 262
Khandekar, Viren Flower Mound, US 23 452
Nguyen, Hien D The Colony, US 5 266
Thambidurai, Karthik Plano, US 11 304

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