SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME
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United States of America Patent
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Issued Date -
May 2, 2013
app pub date -
Oct 26, 2011
filing date -
Oct 26, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Various semiconductor chip devices and methods of assembling the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a frame to a surface of a substrate. The surface of the substrate is adapted to hold a first semiconductor chip that includes an upper surface. The frame includes an internal wall that is adapted to engage plural sidewalls of the first semiconductor chip. A portion of the internal wall and at least a portion of the upper surface are adapted to define an internal space.
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