Flattened substrate surface for substrate bonding
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United States of America Patent
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Jul 15, 2014
Grant Date -
May 2, 2013
app pub date -
Oct 31, 2011
filing date -
Oct 31, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
Methods for bonding substrate surfaces, bonded substrate assemblies, and design structures for a bonded substrate assembly. Device structures of a product chip are formed using a first surface of a device substrate. A wiring layer of an interconnect structure for the device structures is formed on the product chip. The wiring layer is planarized. A temporary handle wafer is removably bonded to the planarized wiring layer. In response to removably bonding the temporary handle wafer to the planarized first wiring layer, a second surface of the device substrate, which is opposite to the first surface, is bonded to a final handle substrate. The temporary handle wafer is then removed from the assembly.
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