Laminate interconnect having a coaxial via structure

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United States of America Patent

PATENT NO 9041208
APP PUB NO 20130105987A1
SERIAL NO

13287194

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Abstract

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A laminate interconnect structure includes a core material and at least one additional layer adjacent the core material, a first electrically conductive via formed in the core material, and a second electrically conductive via formed in the core material, coaxial with the first electrically conductive via and separated from the first electrically conductive via by a non-conductive material.

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Patent Owner(s)

Patent OwnerAddress
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LIMITEDSINGAPORE 768923

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Connor, John Colorado Springs, US 33 1045
Devnani, Nurwati Suwendi Fort Collins, US 3 34
Gallegos, Adam Fort Collins, US 4 33
Hinton, Mark Fort Collins, US 4 29

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