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United States of America Patent

PATENT NO 8823164
APP PUB NO 20130105994A1
SERIAL NO

13284522

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A chip packaging apparatus includes a substrate, a load frame attached to the substrate by an adhesive material, the load frame being formed to define an aperture and a semiconductor chip mounted on the substrate within the aperture. A thickness of the adhesive material between the load frame and the substrate is varied and adjusted such that a surface of the load frame opposite the substrate is disposed substantially in parallel to a surface of the chip opposite the substrate.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Colgan, Evan G Chestnut Ridge, US 140 2974
Gaynes, Michael A Vestal, US 118 1570
Zitz, Jeffrey A Poughkeepsie, US 53 640

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