Semiconductor device structures and their fabrication
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United States of America Patent
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Sep 10, 2013
Grant Date -
May 2, 2013
app pub date -
Dec 19, 2012
filing date -
Sep 25, 2008
priority date (Note) -
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Abstract
A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.
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