Pressure sensing and control for semiconductor wafer probing
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United States of America Patent
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Feb 24, 2015
Grant Date -
May 2, 2013
app pub date -
Oct 31, 2011
filing date -
Oct 31, 2011
priority date (Note) -
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Abstract
A wafer probing system includes a probe card assembly having a plurality of individual probe structures configured make contact with a semiconductor wafer mounted on a motor driven wafer chuck, with each probe structure configured with a pressure sensing unit integrated therewith; and a controller configured to drive the probe card assembly with one or more piezoelectric driver units response to feedback from the pressure sensing units of the individual probe structures.
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