LAMINATING STRUCTURE, ELECTRONIC DEVICE HAVING THE LAMINATING STRUCTURE AND LAMINATING METHOD THEREOF
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United States of America Patent
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Issued Date -
May 2, 2013
app pub date -
Apr 26, 2012
filing date -
Nov 2, 2011
priority date (Note) -
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Abstract
A laminating structure, an electronic device having the laminating structure and a laminating method thereof are provided. The laminating structure comprises a bonding frame disposed on a peripheral area of a first substrate, wherein surface of the bonding frame comprises a plurality of protrusions and an interspace that is provided between each two adjacent protrusions for containing an overflow portion of a liquid adhesive. The present disclosure utilizes a method of forming a patterned bonding frame to prevent adhesive from overflowing during the process of laminating substrates. Therefore, in the present disclosure, steps of adhesive scraping and adhesive cleaning are omitted so as to reduce labor and material costs.
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