ENCAPSULATION OF EMS DEVICES ON GLASS
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United States of America Patent
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N/A
Issued Date -
May 2, 2013
app pub date -
Oct 31, 2011
filing date -
Oct 31, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
This disclosure provides systems, methods and apparatus for fabricating encapsulated devices, including electromechanical systems devices. In one aspect, a cover plate including one or more encapsulation lids releasably attached to a carrier substrate is provided. The one or more encapsulation lids can be joined to a device substrate to encapsulate one or more devices on the device substrate in a batch process. After joining, the encapsulation lids are released from the carrier substrate resulting in the formation of encapsulated devices on the device substrate. In another aspect, encapsulated devices are provided.
First Claim
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International Classification(s)
- C23C:COATING METALLIC MATERIAL; COATING MATERIAL WITH M....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- G06T:IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....
- B44C:PRODUCING DECORATIVE EFFECTS
- [Classification Symbol]
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