MULTILAYERED CERAMIC CAPACITOR WITH IMPROVED LEAD FRAME ATTACHMENT
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United States of America Patent
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Issued Date -
May 2, 2013
app pub date -
Oct 28, 2011
filing date -
Oct 28, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.
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