CIRCUIT SUBSTRATE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURING CIRCUIT SUBSTRATE
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United States of America Patent
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Issued Date -
May 2, 2013
app pub date -
Oct 16, 2012
filing date -
Oct 28, 2011
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A circuit substrate includes a single-layer insulating substrate, a through-hole, and wiring conductors that are provided in both main surfaces of the single-layer insulating substrate. The through-hole includes first and second concave portions that are formed in both of the main surfaces of the single-layer insulating substrate, respectively, and a through-portion through which both of the concave portions communicate with each other. An opening area of a portion at which the first and second concave portions overlap each other is a half or less of an opening area of any large concave portion between both of the concave portions, and a metallic film is formed on the respective inner wall surfaces of the first and second concave portions, and the through-portion.
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