Method for manufacturing silicon carbide substrate and method for manufacturing semiconductor device

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United States of America Patent

PATENT NO 8969103
APP PUB NO 20130109110A1
SERIAL NO

13807197

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Abstract

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A silicon carbide substrate is made of silicon carbide. In the silicon carbide substrate, a normal line of one main surface of the silicon carbide substrate and a normal line of a {03-38} plane form an angle of 0.5° or smaller in an orthogonal projection to a plane including a <01-10> direction and a <0001> direction. In this way, there can be provided the silicon carbide substrate allowing for both improvement of channel mobility of a semiconductor device and stable characteristics thereof.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO ELECTRIC INDUSTRIES LTDOSAKA JAPAN OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harada, Shin Osaka, JP 131 787
Itoh, Satomi Osaka, JP 21 192
Okita, Kyoko Itami, JP 63 152
Sasaki, Makoto Itami, JP 458 4514

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