METHOD AND JIG FOR MANUFACTURING SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
May 2, 2013
app pub date -
Mar 12, 2012
filing date -
Oct 27, 2011
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
According to an embodiment, a method for manufacturing a semiconductor device includes steps of enveloping a semiconductor chip attached to a lead frame with a resin and mounting a film-like member in a pocket provided in a base portion of a jig. The method further includes steps of making the resin in contact with the film-like member by covering the pocket with the portion of the lead frame having the semiconductor chip fixed thereto, after fixing the lead frame to a movable portion of the jig and moving the movable portion in a direction of the base portion; and curing the resin with the lead frame in a state covering the pocket.
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