METHOD OF MANUFACTURING THIN FILM-BONDED SUBSTRATE

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Issued Date
May 9, 2013
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Nov 5, 2012
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Nov 4, 2011

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Abstract

A method of manufacturing a thin film-bonded substrate in which a high-quality gallium nitride (GaN) thin film can be transferred. The method includes implanting ions into a first

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Patent Owner	Address
SAMSUNG CORNING PRECISION MATERIALS CO LTD	GYEONGBUK SOUTH KOREA CHUNGCHEONGBUK-DO

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
EO, Sungwoo	ChungCheongNam-Do, KR	11	8
KIM, Kyoungjun	ChungCheongNam-Do, KR	15	29

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METHOD OF MANUFACTURING THIN FILM-BONDED SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

13668831

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