SURFACE TREATMENT METHOD OF POLISHING PAD AND POLISHING METHOD OF WAFER USING THE SAME
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United States of America Patent
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Issued Date -
May 9, 2013
app pub date -
Nov 5, 2012
filing date -
Nov 7, 2011
priority date (Note) -
Abandoned
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Abstract
Provided is a surface treatment method of a polishing pad. The surface treatment method of the polishing pad includes locating a wafer on the polishing pad including a polishing material, supplying a polishing pad polishing material between the polishing pad and the wafer to expose the polishing material included in the polishing pad, and polishing the wafer using the exposed polishing material.
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